| 摘要 |
PURPOSE:To prevent unnecessary overflow of materials such as conductive paste, by a method wherein an enclosure wall larger than a semiconductor substrate is formed on a mount on which a semiconductor substrate is mounted. CONSTITUTION:A mounting part 2 larger than the semiconductor substrate and an enclosure wall 3 around the mounting part 2 are composed on a mount 1 on which a semiconductor substrate 5 is mounted. On the said mounting part 2 adhesive 4 such as conductive paste or a piece of soldering material is provided and the semiconductor substrates 5 is mounted and heated to be adhered. Thus, by the existence of the enclosure wall, overflow of the adhesive is prevented so that the harmful effect of the overflow is eliminated and, moreover, the accuracy of fixing position is improved. |
