| 摘要 |
PURPOSE:To simplify the assembling of a semiconductor chip and to reduce the cost of the chip by bonding a plurality of conductive spacers on one wafer and then dividing it into individual semiconductor chips. CONSTITUTION:A plurality of planar type semiconductor elements in which p-n junctions are disposed on one main surface of one semiconductor wafer sheet are formed, an insulating film 3 of SiO2, glass or the like is then formed, windows are opened at the corresponding positions, and metallized layers 4, 5 are formed to form electrode metals on both surfaces. Subsequently, conductive spacers 16 are connected via a high melting point solder cream 30 to the electrode metal. Thereafter, a wafer is cleaned, is blown, and is then divided into individual semiconductor chips 15. In this manner, it can simplify the assembling steps and can reduce the cost of the chips. |
