| 摘要 |
PURPOSE:To enable to easily adjust the parallelism when a bonding work is performed by a method wherein the parallelism between the surface of the bump formed on a semiconductor chip and the surface of a tool is corrected by a profiling mechanism consisting of a spherical sliding section. CONSTITUTION:The chip 2 whereon the bump was formed is placed on the heat insulating material fixed on a profiling ball 5 and the pattern 7 formed on a tape 8 and the bump 3 are bonded by applying pressure and heat using a heating tool 1. The bump is conformed to the lower surface of the tool 1 in such a manner that the applied pressure will be equalized without having a sufficient parallelism between the tool 1 and the bump 3 by freely sliding the spherical contact section of the profiling ball support 6. Through these procedures, as the parallelism is corrected, the adjusting work for parallelism is unnecessitated and also a stabilized bonding can be performed even when there is variation in parallelism resulted from thermal deformation and the like. |
