| 摘要 |
A method of molding and a mold are provided for encapsulating devices such as axial lead cylindrical electrical devices in which two separable portions of the mold closely embrace the axial leads near the axial ends of the mold cavity and one of the mold portions includes piston-like parts, one for each molding cavity, which moves between at least two positions. In one position of a piston-like part of the mold, and mold cavity is open to receive encapsulating fluid and in the other position of the part the mold cavity is completely closed. In a modification, the piston-like parts are each shaped and positioned to form parts of adjacent molding cavities. The molding process involves supplying encapsulating fluid to the several cavities by applying pressure to the whole body of fluid and applying higher pressure to the fluid in each molding cavity.
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