| 摘要 |
<p>PURPOSE:To provide a shielding effect in an integrated circuit device by forming a metallic film used as a ground potential on the surface except at least a part of the respective bonding pads of a semiconductor substrate having mutual wires covered with insulating film. CONSTITUTION:Metallic wiring layers 2, 3 formed via an insulating film 4 on a semiconductor substrate 1 are covered with a protective film 6 of polyimide resin or alumina, etc., a metallic layer 7 of aluminum or the like is formed on the surface except the part of the respective bonding pads 5, and is connected to the ground bonding pad as a ground potential. In this manner, it can provide shielding effect against the external noise, light shielding effect, and parasitic oscillation suppressing effect.</p> |
