发明名称 CHITSUPUTESUTOSOCHI
摘要 PURPOSE:To enable the electric connection of a chip to an external circuit without damage to the chip to be tested by utilizing the projection of mercury filled in a substrate as the end of a probe. CONSTITUTION:A chip 5 to be tested is supported by a support 9 for the chip to be tested, and a socket substrate 10 is secured by a guide post 11 to a base substrate 8. An elevationally movable wiring substrate 12 is mounted on the post 11. The substrate 10 has a lower half part 10-1 and an upper half part 10-2 with a plurality of cavities 10 having wide interior and narrow inlet and mercury 13 filled therein. A terminal 6 of the chip 5 to be tested is inserted into one inlet of the substrate 10, and a test pin 15 on the wire 14 of a strip line formed on the substrate 12 is inserted into the other inlet. In this manner the chip 5 to be tested and the wire 14 on the substrate 12 are electrically connected via the mercury 13.
申请公布号 JPS5736841(A) 申请公布日期 1982.02.27
申请号 JP19800112803 申请日期 1980.08.15
申请人 发明人
分类号 G01R31/26;H01L21/66;(IPC1-7):01L21/66 主分类号 G01R31/26
代理机构 代理人
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