摘要 |
PURPOSE:To enable the electric connection of a chip to an external circuit without damage to the chip to be tested by utilizing the projection of mercury filled in a substrate as the end of a probe. CONSTITUTION:A chip 5 to be tested is supported by a support 9 for the chip to be tested, and a socket substrate 10 is secured by a guide post 11 to a base substrate 8. An elevationally movable wiring substrate 12 is mounted on the post 11. The substrate 10 has a lower half part 10-1 and an upper half part 10-2 with a plurality of cavities 10 having wide interior and narrow inlet and mercury 13 filled therein. A terminal 6 of the chip 5 to be tested is inserted into one inlet of the substrate 10, and a test pin 15 on the wire 14 of a strip line formed on the substrate 12 is inserted into the other inlet. In this manner the chip 5 to be tested and the wire 14 on the substrate 12 are electrically connected via the mercury 13. |