| 摘要 |
PURPOSE:To prepare the titled composition having excellent impact strength and processability, and suitable for the housing of electronic devices, etc., by compounding a polyamide resin with aluminum flakes and an ethylene copolymer modified with an unsaturated carboxylic acid. CONSTITUTION:The objective composition is prepared by blending (A) 100pts.wt. of a polyamide resin with (B) 1-100pts.wt. of a modified ethylene copolymer having a crystallinity of <=75% and a melt index of 0.01-50, and obtained by the graft polymerization of 0.05-1.5wt% of an alpha,beta-unsaturated carboxylic acid (esp. maleic anhydride) or its derivative to a copolymer of ethylene (>=50mol%) and a >=3C alpha-olefin (pref. propylene, etc.), and (C) 1-100pts.wt. of aluminum flakes having an average diameter of 0.05-5mm., average thickness of 1-100mu, and a diameter/ thickness ratio of 10-200. The blending is carried out, e.g. at 200-280 deg.C. |
