Attaching semiconductor wafer to housing base plate - brazing or soldering using screen printed paste of braze metal or solder

摘要

Base plate for semiconductor housing comprises a metallised area onto which at least one wafer or component is to be fixed by brazing in a precise position. Specifically a metallic braze compsn. in the form of a paste is screen printed onto the base plate in a pattern of localised deposit bounded by the contour of the wafer or component. Positioning of components inside housings is facilitated, thus contributing to the regularity and optimisation of the lengths of joints. The method is used for power components or signalling components.