发明名称 Method and apparatus for automatically mounting non-lead electronic components on printed-circuit or similar boards.
摘要 A method and an apparatus for automatically mounting, on printed circuit boards, non-lead electronic components (C) which are stored mutually independently within a multiplicity of apertures (30) equally spaced longitudinally in a strip member and is covered with a covering tape. The covering tape is separated first by a covering tape separating assembly (50, 52, 54, 64) from the strip member so as to uncover a leading one of the apertures. A leading portion of the strip member including the uncovered leading aperture is cut off the strip member by a severing assembly (184, 196) consecutively. A plurality of the leading portions (216) cut off the strip members respectively storing different kinds of components are arranged on a transfer element (198) of a transfer assembly (198, 200, 220, 222, 224) in a desired order and transferred to a fixed position by the transfer member. Each component stored in the cut-off leading portions is picked up, transferred, and mounted on a printed circuit board one by one. The uncovered and cut-off leading portion is utilized as a part of the transfer assembly.
申请公布号 EP0046334(A1) 申请公布日期 1982.02.24
申请号 EP19810303163 申请日期 1981.07.10
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 ASAI, KOICHI;OE, KUNIO;TUDA, MAMORU
分类号 H05K13/00;B23P21/00;H05K3/30;H05K13/02;H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K13/00
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