| 摘要 |
1338188 Lead frames for integrated circuits RCA CORPORATION 3 May 1972 [13 May 1971] 20562/72 Heading H1K The semi-conductor supprting pad 16 and at least the inner ends 20 of the leads 18 of a lead frame for an integrated circuit are non-coplanar. While the connector leads 30 are being bonded, e.g. ultra-sonically, to the lead ends 20 and to the semiconductor wafer the frame is mounted in a jig which forces the pad 16 and the lead ends 20 into coplanar relationship, but the frame returns to the non-coplanar configuration shown on release from the jig. The non-planar relation may be obtained by bending the struts holding the pad 16 and/or the leads 18. The completed assembly may be moulded in a polymeric plastics envelope. |
