| 摘要 |
PURPOSE:To increase the adhesive strength of a case and cover as well as to improve the workability for the subject semiconductor by a method wherein grooves are provided at the section opposing to the inner wall of the opening part of the case, in the recess section of which a chip is stored, and a rectangular cover is fitted by sliding along the grooves. CONSTITUTION:A ceramic substrate 3 is soldered on the heat sink 4 fixed at one of the openings on a frame 11, the chip 1 is soldered at the conductor 2 on the substrate 3 and, at the same time, an electrode is connected to lead-out terminals 6a- 6c. After resin material 8 is filled in the case wherein the chip 1 is contained, the cover 12 is fitted to the grooves 11a and 11b provided at the other opening part of the frame 11 and then the cover 12 and the frame 11 are adhered and hermetically sealed using an adhesive material. Through these procedures, the usage of a special jig is unnecessitated when performing a heat treatment on the bonded frame and the cover, the workability is improved and the lowering of the adhesive strength can also be prevented. |
