| 摘要 |
PURPOSE:To shorten a forming cycle, by a method wherein thermal expansion and contraction arising from the in-and-out reciprocation of a press is eliminated to prevent faulty positioning while discontinuing the operation to take out a frame reloading plate at every forming cycle. CONSTITUTION:A semiconductor frame 12 is carried by a carrier device 48 equipped with an aligning device 21 into a press to be positioned at the fixed position. A shaft 33 goes up synchronously, the frame 35 goes up in parallel through the base 34 and a flexible joint 37, while a pin 42 is set free coming off a hole 44 of the frame 35 and is freely fitted in a hole 50 of a bush 51 of the carrier device 48 to correctly align the frame 12 with the reloading plate on the frame 46. Thereafter, the pin 17 of the reloading plate is fitted into the positioning hole of the semiconductor frame 12, the device 21 is opened holding the frame 12 with the pin 17. Subsequently the reversing operation is performed in turn to position the frame 12 through the pin 42 and the frames 35 and 46 to a slide table 5, while the lower mold 7 is also placed on the table 5 through a fixed plate 54 and the frame is correctly matched also to the lower mold. According to said constitution, the plate 16 is not required to be taken out of the press at every cycle, thus eliminating the faulty positioning. |
