Process for electroplating palladium on articles comprising copper

摘要

A process and bath composition is described for the electroplating of palladium. The bath contains a source of palladium and thiourea or related compounds to prevent poisoning of the bath from copper ions contained on surfaces to be plated. It is particularly useful in palladium electroplating processes where foreign ions such as copper ions adversely affect the plating process. Such contamination is likely to occur where palladium is electroplated on copper or copper alloy surfaces such as are used in electrical contact devices such as switches, relays, connectors, etc. The palladium electroplating process and bath described in the disclosure yields excellent results even where extensive impurities such as copper ions have been introduced into the plating bath.