| 摘要 |
1330613 Electro-depositing nickel M & T CHEMICALS Inc 29 March 1972 [1 April 1971] 14857/72 Heading C7B A semi-bright, ductile level, S-free Ni plate is electro-plated on to a basis metal, e.g. steel, Cu, brass, bronze or Zn die casting bearing a Cu plate, from an aqueous acidic Ni plating solution containing at least one Ni compound, eg sulphate, chloride, sulphamate for fluoborate with boric acid, and 3 - hexyne - 2, 5- diol and a compound selected from formaldehyde, chloral (hydrate) and bromal (hydrate) as semi-brightening additives. The anode may be lead, or nickel squares in a titanium basket. The solution may also contain Na lauryl sulphate or di-n-hexyl sulphosuccinate. Preferably a relative velocity of 60-320 cm/sec is maintained between the solution and cathode by ultrasonic vibration, cathode rotation, electrolyte pumping or agitation |
