| 摘要 |
PURPOSE:To connect optical fibers at a low loss with high accuracy by selectively removing the prescribed positions of a photoresist film provided on a substrate surface for optical fiber connection, using the same as a mask, plasma etching the substrate and forming U-shaped fiber connecting grooves. CONSTITUTION:The surface of a silicon substrate 21 polished to a specular surface is thermally oxidized to form a silicon oxide film 22 to 0.5-1mu thicknesses, thereafter a photoresist film 23 is formed on the film 22. The film 23 is then selectively removed to form opening parts 24 which serve as guide grooves. Thence, with the film 23 as a mask, the SiO2 film 22 and the substrate 1 are subjected to plasma etching by using an etching gas consisting of adding a slight amount of O2 to gaseous CF4, whereby U-shaped grooves 25 of a semicircular shape in section are formed. Thereafter, the resist film 23 is removed, and this yields a connector for the purpose of connecting fibers 26. Since the fibers 26 makes face contact with the grooves 25, the connection is accomplished at a low loss with good accuracy. |
