| 摘要 |
A low profile socket for accommodating an integrated circuit pack to be mounted on an integrated circuit board is characterized by having a U-shaped cross section, with the inside portion of each upstanding wall being defined by a plurality of 3-sided channels defined by partitions extending transverse to the longitudinal axis of the socket. A terminal pin is disposed at each channel, each terminal having a post section extending from the lower portion of the socket for passage through the integrated circuit board for connection to a conductor. The transverse width of the socket is sufficient to fully accommodate the main body of an integrated circuit pack, with the leads of the integrated circuit pack establishing electrical contact with the upper portions of the terminal pins through the open side of each channel. If desired, a molded insert generally rectangular in plan form, is adapted to be snapped into place between the integrated circuit pack and the partitions of the socket for use as both a cover and a means for retaining the pack in place. The total height of the composite assembly of the socket and the pack is approximately equal to the height of the socket.
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