| 摘要 |
<p>PURPOSE:To obtain a flat type semiconductor device in which a semiconductor element and a radiator are accurately coaxially placed by soldering a positioning member to a sealed container itself. CONSTITUTION:A semiconductor device 1 is fusion-bonded to a heat compensator 2 made of W, Mo or the like with solder made of aluminum alloy to form a semiconductor element 3. A positioning member 14 for positioning the semiconductor element 3 is soldered to both the annular insulator 10 and the flange 11 of a container at the time of assembling the container. The axially centering accuracy of a radiator 4, flanges 15, 11, annular insulator 10 and positioning metal 14 can be improved at the time of assembling the container, thereby improving the positional accuracy of the semiconductor element 3 to be engaged with the positioning metallic member 14.</p> |
