发明名称 Electrodeposition esp. of nickel onto glass - using cathode bar connected by claw contacts to suspended glass plates
摘要 <p>Electrodeposition appts. for metallising substrates comprises a U-shaped frame (1) of non-conducting material intended to be immersed in the electrolyte bath and an electrical supply conductor bar (2) across the opening of the U; Parallel to this conducting bar and below it is a non-conducting spacer bar (3). The substrates to be coated are hung vertically alongside this spacer bar, clamp-d to it by contact claws gripping across the bar (3) and across the current supply bar (2). The feed into the conducting bar (2) is through suspension hooks (10) which can be adjusted in height and serve also for suspending the entire frame in the bath. The inner face of the U-frame (1) is partly blanked off at front and back by plates (16). Used esp. for the deposition of nickel on glass sheets. The appts. enables a very good and uniform electrical contact between the glass sheet substrates and the cathode contact bar (2) to be obtd. This results in a very uniform coating thickness, meeting the requirements of 100 microns +/- 4 micron over the entire area.</p>
申请公布号 DE3027751(A1) 申请公布日期 1982.02.18
申请号 DE19803027751 申请日期 1980.07.22
申请人 SIEMENS AG 发明人 FLOEGEL,LOTHAR,DIPL.-CHEM.DR.
分类号 C25D17/00;(IPC1-7):25D17/00 主分类号 C25D17/00
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