| 摘要 |
<p>The present invention is directed to a thermosettable composition comprising a terminally unsaturated vinyl ester resin comprising the reaction product of an unsaturated monobasic acid with a polyepoxide, at least one vinyl monomer copolymerizable therewith, and a low profile additive characterized in that the low profile additive has the formula: wherein R1 and R2 are hydrogen, methyl or ethyl with the provision that, if either R1 or R2 is hydrogen, the other is methyl or ethyl, B is the residue of a hydroxyl containing initiating compound with the value of p equal to or less than the number of hydroxyls in the initiating compound and n and m are whole numbers such that said additive is soluble in said composition when uncured and insoluble in said composition when cured. These compositions are useful in molding sheets and reinforced molded articles. 18,351A-F</p> |
