SEMICONDUCTOR-DEVICE CARD

摘要

A memory card comprises a plastic outer package which houses a semiconductor device and an electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. At least one of the connecting surface of each pair of adjoining package sections has an overflow groove for bonding agent formed therein which prevents the bonding agent from being forced to the outside of the outer package when the package sections are bonded together.