| 摘要 |
PURPOSE:To prevent the split and breakage of the semiconductor pellet at the time of mounting by adsorbing the pellet by means of a collet, a flat lower end surface thereof has an adsorption hole, through a granular member having elasticity. CONSTITUTION:When the semiconductor pellet 1 is mounted onto solder 5 on a radiating plate 4, a proper amount of the granular members 12 having elasticity such as cone rubber are attached previously on the pellet, and the pellet is adsorbed by means of the collet 9, to the flat lower end surface 10 thereof an adsorption hole 11 is opened, and transported onto the radiating plate. Accordingly, the pellet is not mounted slantingly, and pushing at the time of mounting is relaxed by means of the granular members, thus removing the split and breakage of the pellet. |
