发明名称 FORMING METHOD FOR ELECTRODE AND WIRING LAYER OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain aluminum electrode and wire of microminiature pattern by coating a mask of high molecular material via a layer of Mo or the like readily forming chloride on an aluminum layer and sequentially etching it with gas plasma including Cl2. CONSTITUTION:An aluminum layer 4 is formed on an SiO2 film 3 exposed at the active layer 2 of a substrate 1. Then, an Mo layer 5 and a resist mask 6 are formed. When it is etched with gas plasma of CCl4:Ar=3:7, the chlorides of Mo and Al are sequentially formed, and no alumina is formed on the aluminum surface. Thus, microminiature electrode and wire patterns can be formed. Cr, Ti, etc. readily forming chloride can be used in addition to the Mo.
申请公布号 JPS5726430(A) 申请公布日期 1982.02.12
申请号 JP19800101999 申请日期 1980.07.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 SUZUKI YOSHIKI;WATAKABE YAICHIROU;YAMAZAKI TERUHIKO
分类号 H01L23/52;H01L21/28;H01L21/3205 主分类号 H01L23/52
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