| 摘要 |
PURPOSE:To obtain the prescribed bevel part uniformly with good reproducibility by holding and rotating a semiconductor element and contacting two types of diamond grindstones having suitable grain size and the prescribed shape with a part to be machined of the element. CONSTITUTION:When a semiconductor pellet 1 is soldered at 2 to a substrate 3, is held with upper and lower rotary chucks 14, 15 and the surfaces 11, 13 of grindstones 10, 12 are contacted with the periphery of the pellet 1, the latter is machined at two-step bevel structure. By variously altering the shapes of the surfaces 11, 13 of the grindstones, the pellet can be uniformly machined at the bevel shape with good reproducibility. |
