发明名称 |
Chip-resistor for printed circuit boards - comprise insulating foil carrying contact coated resistor, folded over with contact layer |
摘要 |
<p>A chip resistor with a metallic resistance layer deposited on an insulating material foil, specially for use in module mounting automatics for PCB's, has a structured resistance layer covering one side of a foil of insulating material; a contact layer reinforces the resistance layer. The two end faces of the foil which stand out beyond the chip are folded over through 180 deg., with the two ends leaving an adhesive-filled gap between them. The resistance layer on the other side is based, at least partly, trimmed to the desired resistance, and coated with a protective lacquer. This replaces the conventional chip resistors, produced by a thin film technique, by a simple design which can be produced at low cost by mass production.</p> |
申请公布号 |
DE3027122(A1) |
申请公布日期 |
1982.02.11 |
申请号 |
DE19803027122 |
申请日期 |
1980.07.17 |
申请人 |
SIEMENS AG |
发明人 |
KAUSCHE,HELMOLD,DIPL.-PHYS.;MAYER,GERHARD,DIPL.-PHYS.;PETERS,WINFRIED,DIPL.-PHYS. |
分类号 |
H01C1/142;H01C17/00;H01C17/06;(IPC1-7):01C1/012 |
主分类号 |
H01C1/142 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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