| 摘要 |
A resin composition comprising a resin composition comprising 5 to 95% by weight of a polyphenylene oxide and 95 to 5% by weight of a polyamide and 0.01 to 30 parts by weight of a member selected from the group consisting of (A) liquid diene polymers, (B) epoxy compounds and (C) compounds having in the molecule both of (a) an ethylenic carbon-carbon double bond or a carbon-carbon triple bond and (b) a carboxylic acid, acid anhydride, acid amide, imido, carboxylic acid ester, amino or hydroxyl group per 100 parts by weight of the total of the polyphenylene oxide and polyamide.
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