发明名称 MOLD DEVICE FOR INJECTION MOLDING
摘要 PURPOSE:To prevent generation of cold slug and whiting and obtain the container of excellent transparence by inserting a heating and cooling layer element utilizing Peltier effect at the junction of semiconductors between the nozzle of the injection molding machine and the mold cavity. CONSTITUTION:Parison 3 is formed by injection molding between a cavity mold 1 provided with a cooling water passage 6 and a core mold 2. The heating and cooling layer element 10 is arranged at the cavity bottom mold part 7, surrounding the gate part 9 and its cooling surface 10a faces to the cavity side and its heating surface 10b faces to the injection molding machine side or the runner part B side. This divides the mold part 7 into the low temperature part 7a and the high temperature part 7b. The heating and cooling layer element 10 arranges the plural N type semiconductors 21 and P type semiconductors 23 alternately on a plane and are connected in series by the conductor 23 at its both sides, the temperature difference of 70 deg.C between the surfaces 10b and 10a can be given.
申请公布号 JPS5724220(A) 申请公布日期 1982.02.08
申请号 JP19800099511 申请日期 1980.07.21
申请人 DAINIPPON PRINTING CO LTD 发明人 YAMADA KANEO
分类号 B29C65/00;B29B11/08;B29C45/00;B29C45/26;B29C45/27;B29C45/73;B29C49/00;B29C49/06;B29C49/64;B29C49/68 主分类号 B29C65/00
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