发明名称 |
MOLD DEVICE FOR INJECTION MOLDING |
摘要 |
PURPOSE:To prevent generation of cold slug and whiting and obtain the container of excellent transparence by inserting a heating and cooling layer element utilizing Peltier effect at the junction of semiconductors between the nozzle of the injection molding machine and the mold cavity. CONSTITUTION:Parison 3 is formed by injection molding between a cavity mold 1 provided with a cooling water passage 6 and a core mold 2. The heating and cooling layer element 10 is arranged at the cavity bottom mold part 7, surrounding the gate part 9 and its cooling surface 10a faces to the cavity side and its heating surface 10b faces to the injection molding machine side or the runner part B side. This divides the mold part 7 into the low temperature part 7a and the high temperature part 7b. The heating and cooling layer element 10 arranges the plural N type semiconductors 21 and P type semiconductors 23 alternately on a plane and are connected in series by the conductor 23 at its both sides, the temperature difference of 70 deg.C between the surfaces 10b and 10a can be given. |
申请公布号 |
JPS5724220(A) |
申请公布日期 |
1982.02.08 |
申请号 |
JP19800099511 |
申请日期 |
1980.07.21 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YAMADA KANEO |
分类号 |
B29C65/00;B29B11/08;B29C45/00;B29C45/26;B29C45/27;B29C45/73;B29C49/00;B29C49/06;B29C49/64;B29C49/68 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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