| 摘要 |
PURPOSE:To make stiff the circuit mechanically and to simplify the manufacture, by making the substrate with a metallic plate and providing lines made of conductor and a dielectric substance layer on the surface. CONSTITUTION:After processing holes such as through-holes to a metallic plate 1 being the substrate, a dielectric substance body 2 is coated on the entire surface. As the dielectric substance body, electric characteristics such as dielectric constant can be selected with the 1st priority since no mechanical strength should be taken into account. After the dielectric substance body 2 is fixed, a conductive layer is formed with electroless plating. Unnecessary plating can be removed by etching. On the formed lines can be mounted for chip components with conductive adhesives. |
