| 摘要 |
PURPOSE:To discharge excessive heat to the outside, and to prevent an adverse effect due to heat to a LSI by each bonding a ceramic substrate and a glass epoxy substrate on a supporting plate by using adhesives having excellent thermal conductivity and adhesives having inferior conductivity. CONSTITUTION:The ceramic substrate 12 is bonded to the aluminum supporting plate 10 with the adhesives 16 having excellent thermal conductivity, and the glass epoxy substrates 13 are bonded with the adhesives 17 having inferior thermal conductivity. Tape carriers 18 are mounted between each of the ceramic substrate and the glass epoxy substrates, and the LSIs 19 are attached on the carriers. When the resistance heat elements 20 of the thermal head generate heat, heat elevating the temperature of the ceramic substrate is discharged to the outside through radiation fins 11 from the aluminum substrate by the adhesives 16, and the adverse effects due to heat to the glass epoxy substrate and the LSIs on the substrate are prevented by the adhesives 17. |
