发明名称 |
KUPFERFOLIE FUER EINE GEDRUCKTE SCHALTUNG UND VERFAHREN ZU IHRER HERSTELLUNG |
摘要 |
A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil. |
申请公布号 |
DE3112216(A1) |
申请公布日期 |
1982.02.04 |
申请号 |
DE19813112216 |
申请日期 |
1981.03.27 |
申请人 |
FURUKAWA CIRCUIT FOIL CO.,LTD. |
发明人 |
NAKATSUGAWA,HIROSHI |
分类号 |
C23F1/00;C25D3/56;C25D5/10;C25D7/06;H05K1/09;H05K3/38;(IPC1-7):05K1/09;25D3/12;25D3/56;25D7/04;01B5/14 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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