发明名称 KUPFERFOLIE FUER EINE GEDRUCKTE SCHALTUNG UND VERFAHREN ZU IHRER HERSTELLUNG
摘要 A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil.
申请公布号 DE3112216(A1) 申请公布日期 1982.02.04
申请号 DE19813112216 申请日期 1981.03.27
申请人 FURUKAWA CIRCUIT FOIL CO.,LTD. 发明人 NAKATSUGAWA,HIROSHI
分类号 C23F1/00;C25D3/56;C25D5/10;C25D7/06;H05K1/09;H05K3/38;(IPC1-7):05K1/09;25D3/12;25D3/56;25D7/04;01B5/14 主分类号 C23F1/00
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