| 摘要 |
PURPOSE:To automatically dispose the chip securing position at the center of a chip mounting part when securing the chip via molten wax by forming wavy pattern on the outer periphery of the chip mounting part of a support, e.g., ceramic package, leadframe, etc. CONSTITUTION:A chip mounting metallized part 14 having a wave pattern is formed on the outer periphery of the first ceramic layer 12 of a laminated ceramic package 10. The part 14 is formed by sequentially plated with Ni and Au on the primary later, e.g., tungsten or the like. A solder preform 24, a semiconductor chip 26 are sequentially placed and heated treated on the part 14 in the cavity. When the chip is placed eccentrically with respect to the part 14, the solder operates with surface tension in the molten state, thereby returning the chip to the center of the part 14. Thus, the chip can be automatically disposed at the center fixedly. |
