| 摘要 |
PURPOSE:To flatten a surface to be polished, by a method wherein a substance to be polished is vacuum-sucked to polish a surface to be worked, the substance to be polished is released from vacuum adhesion, the side of the substance to be polished is nipped to polish the surface to be polished. CONSTITUTION:A disc-shaped substrate 4 is placed on the surface of an adsorbing part 11a of each vacuum suction table 11, and is then vacuum-sucked. The diamond grinding stone of a platen 13 for first polishing is rotated, and a mounting table 12 is rotated. When the substrates 4 are rotationally moved to the respective platens 13 for polishing, the substrate 4 is polished by the diamond grinding stone. This polishing regulates the thickness of each of the four substrates 4 to complete a first polishing process. The substrates are released from vacuum adhesion by each vacuum suction table 11, a press part 11b2 of the suction table 11 is moved in a direction A, and the side of the substrate 4 is nipped by means of a ring 11b1 and a press part 11b2. The diamond grinding stone of a platen 14 for second polishing is lowered as it is rotated, and waviness of the substrate 4 is removed. The mounting table 12 is rotated, and the waviness of all the four substrates 4 is removed. |
