| 摘要 |
PURPOSE:To remove the adverse influence of a flowed resin from a semiconductor device by forming a resin passage communicating the interior of a container with the exterior of the container at a cover for covering the upper opening of the casing, and separably formed a flowed resin receiving container on the peripheral wall of the casing. CONSTITUTION:A semiconductor element 6 is provided in a casing 2 made of a base 1 and a peripherel wall 3, a passage 13 of resin 9 communicating approximately horizontally the interior of the casing with the exterior of the casing is formed at a cover 5 for covering the opening of the casing, and a container 15 for containing flowed resin 16 is readily separably formed on the peripheral wall 3 of the casing. Thus, the resin can be completely filled in the casing, and adverse influence of the flowed resin can be removed, and accordingly the performance of the semiconductor device can be improved. |
