| 摘要 |
PURPOSE:To reduce the steps of inspecting a module by providing an inspecting substrate having heating means on the back surface and means for attracting and feeding an element, and heating and detachably attaching the element having a solder terminal to the substrate, thereby measuring the high frequency characteristic or the like before mounting. CONSTITUTION:An element 4 soldered to a large scale circuit module substrate is mounted and inspected at an inspecting substrate 1 having desired characteristic inspecting circuit before mounting. An infrared lamp 13 is, for example, provided on the back surface of the inspecting element mounting position of the substrate 1, and the substrate heating temperature is locally controlled by the detected temperature of the thermocouple 10. The element 4 is attracted and held by a nozzle 15, and is conveyed, and a solder electrode 5 is molten and connected to the connection terminal 3 of the substrate 1. After the predetermined measurement and inspection are completed, the substrate 1 is again heated, the element 4 is attracted, and the substrate 1 is conveyed. Thus, since the propriety of the circuit functions of the element 4 can be simply inspected in advance, the steps of exchanging the element can be reduced, and the number of the steps of inspecting the module can be reduced. |
