发明名称 Method of fabricating a charge transfer channel covered by a stepped insulating layer
摘要 The disclosed memory cell is comprised of a charge storage region and an adjacent charge transfer channel. A deep dopant layer extends throughout the charge storage region, and a shallow dopant layer extends throughout the charge storage region plus part-way through the charge transfer channel. Overlying the charge storage region is a first conductor that is completely covered by a thick insulating layer. This thick insulating layer also extends into the charge transfer channel part-way over the shallow dopant layer. A thin insulating layer covers the remaining portion of the channel. Lying on this thin insulating layer and extending onto the thick insulating layer is a second conductor. Parasitic capacitance and catastrophic shorts between the two conductors are minimized by the thick insulating layer; charge storage capacity of the storage region is maximized by the two dopant layers lying therein; and cell length is minimized by the thick insulating layer and underlying shallow dopant layer in the charge transfer channel.
申请公布号 US4313253(A) 申请公布日期 1982.02.02
申请号 US19800113388 申请日期 1980.01.18
申请人 BURROUGHS CORPORATION 发明人 HENDERSON, SR., DONALD L.
分类号 H01L21/8242;H01L27/108;(IPC1-7):H01L21/22;H01L21/26 主分类号 H01L21/8242
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