| 摘要 |
<p>A carrier for dual-in-line integrated circuit package having a rigid flat body is provided with retention means including an opposite pair of cantilever fingers integrally formed in opposite walls of the carrier and rearwardly extending therefrom in elongated form and at an acute angle with body-engaging surfaces provided with a plurality of rearwardly spaced-apart detents to accommodate bodies of differing thicknesses. The cantilever fingers are adapted to be deflected toward the walls by insertion of the body with at least one of the detents engaging a side of the body in a finger-force releasing relationship. The carrier also is provided with guide shoulders and rearwardly positioned support shoulders for predetermined positioning of the packages.</p> |
