| 摘要 |
PURPOSE:To enable bonding of a semiconductor pellet without requiring oscillating operation by melting a solder material in contact with a lead conductor in a clearance through which a semiconductor pellet approaches the lead conductor after oxides are removed from the surface thereof by reduction. CONSTITUTION:A lead conductor 1 is passed through a high temperature reducing atmosphere to remove oxides formed on the surface thereof. Then, the lead conductor approaches a semiconductor pellet with a slight clearance left therebetween maintaining a high temperature by forming an array of convexes and concaves on the lead section and then, a bar-shaped solder is melted in contact with the lead conductor 1 so that the semiconductor pellet is bonded to the conductor by the surface tensile of the melted solder 4. This enables the bonding of the semiconductor pellet and the lead conductor without requiring oscillating operation. |
