| 摘要 |
<p>PURPOSE:To reduce the chips produced at a semiconductor at the cutting time by cutting the semiconductor and the insulator with different blades. CONSTITUTION:When a semiconductor wafer 30 formed of a plurality of resistors and diaphragms 32 on a wafer is bonded to an insulator 28 and is integrally cut, the wafer 30 and the insulator 28 are cut with different blades. For example, a semiconductor strain gauge chip 30 of wafer state is bonded onto the upper surface of the insulator 28, and is cut along broken lines 38 at a high speed initially with an exclusive silicon blade from the side of the wafer 30. Then it is cut along the broken line 40 at the insulator 28 at a low speed with an exclusive insulator (glass) blade.</p> |
