| 摘要 |
PURPOSE:To facilitate continuous automation of a plurality of semiconductor devices through etching, flux coating and soldering of the terminals thereof by employing a lead frame for supporting the semiconductor devices with the cutting and bending of the terminals thereof leaving the connection to a hanging pin. CONSTITUTION:A lead frame 4 which supports a resin-sealed semiconductor device 1 with the cutting and bending of the terminals thereof leaving a connection to hanging pin 5 is placed on a guide rail and conveyed along the rail. In the course, the terminals of the device are etched, washed and soldered. Including the washing and drying of the semiconductor devices, the full operation of all processes is done automatically and continuously. This can save time and labor for the aligning work of the semiconductor devices thereby improving the production efficiency while enabling automation connected to other processes. |
