| 摘要 |
PURPOSE:To enable a pellet bonding without requiring oxcillating operation by compressing a semiconductor pellet on a melted solder dropped on a lead conductor in such a manner as to cause vibration after oxides are removed in a high temperature reducing atmosphere from the conductor. CONSTITUTION:A lead conductor 1 is passed through a high temperature reducing atmosphere to remove oxides from the surface thereof. A melted solder 5 is dropped on the lead conductor 1 and a semiconductor pellet 3 is compressed on the solder still virating due to the energy given by dropping. Then, the pellet is connected to other leads with a wire 4. This prevents the oxidation of the solder while eliminating the need for oxcillating operation by utilizing the vibration of the solder thereby providing an inexpensive, high quality semiconductor device. |
