发明名称 ETCHING LIQUID
摘要 PURPOSE:To improve the accuracy of fine working by chemical etching by specifying the ratio of nitric acid and hydrogen peroxide in etching liquid for Ni-Fe plating films. CONSTITUTION:In an etching liquid composition consisting of nitric acid, hydrogen peroxide and water, the nitric acid is limited to 3.3-8.4% and hydrogen peroxide to 10.0-16.7%. If this etching liquid is used for chemical etching of fine working such as Ni-Fe films, the good Ni-Fe films of high working accuracy are obtained. The etching liquid of such composition is suited for making of electromagnetic transducers and the like.
申请公布号 JPS5782473(A) 申请公布日期 1982.05.22
申请号 JP19800157240 申请日期 1980.11.07
申请人 SHARP KK 发明人 OOTSUKA KOUJI
分类号 C23F1/28 主分类号 C23F1/28
代理机构 代理人
主权项
地址