| 摘要 |
PURPOSE:To prevent uneven temperature in a pellet and improve the allowance for the circuit operation by forming a layer of material with a better heat conductivity than the semiconductor material on the back of a pellet subjected to a face- down bonding. CONSTITUTION:A flip chip 10 provided wtih a bump electrode 13 is connected to a circuit board 11 made up of ceramics or the like through a circuit pattern 13 on the board 11. For example, a heat transfer layer 14 made of a silver paste, solder or the like is formed on the back of the pellet thus formed by coating or potting. The thicknes of the heat transfer layer 14 is adjusted properly according to the size of the pellets 10, the quantity of electric energy used and the like. With such an arrangement, any heat locally generated at a specific part 10a in the pellets 10 can be transferred to the surrounding area thereof rapidly with an aid of the heat transfer layer 14 thereby improving the allowance for action in a circuit device by a face- down bonding. |
