| 摘要 |
A heat-damming compound profile for window or door frames or similar components in which there is provided two metal profile rods and an intermediate layer connecting these profile rods. The intermediate layer is composed of a profiled shape-retaining insulating strip. Each profile bar is provided with a forcible guide for the insulating strip and are connected by oppositely located lugs outside the insulating strip. Each lug is provided with a small continuous cam which is movable against a corresponding projection of the insulating strip. The invention also provides a method of making a heat-damming compound profile by pushing the insulating strip into the forcible guides and into the lateral pins of the profile bars, and exerting pressure from the exterior by means of rollers or pressure gliders upon the metallic lugs at simultaneous directed support of the profile bars at the sides opposite the lugs.
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