| 摘要 |
PURPOSE:To prevent chipping of cut periphery of a sheet-plate-shaped object by turning a rotary blade invariably in the upper cutting direction of the object to cut in a dicing methoe in which the object is cut completely after bonded securely. CONSTITUTION:For example, an adhesive, tape 13 on which a semiconductor wafer 10 is bonded sucked onto a stage 12 to retain. This stage 12 is moved from the right to the left, for example, against a rotary blade 14 rotating at a high speed counterclockwise on a shaft fixed to form a diced section 11a on the wafer 10. Then, after the blade 14 is reversed in the clockwise, rotation, the stage 12 is shifted by a pitch P vertically and then, moved to the right to form a diced section 11b. Thereafter, by repeating this procedure, after the dicing is completed in the direction x, likewise, a dicing is performed in the direction y. This allows the blade 14 to cut the wafer invariably in the upper cutting direction so that chips are washed away with a cooling water thereby eliminating defects such as cracking phery of the cut area. |
