发明名称 TRANSISTOR MODULE
摘要 <p>PURPOSE:To miniaturize power transistor composites with an easier parallel connection by connecting the emitter or the first composite and the collector of the second composite so as to be housed in a common container with an electrode terminal led to top thereof. CONSTITUTION:For example, composites I and II having power transistors connected by Darlington arrangement are fastened on a metal base plate 13 through an insulating plates 11a and 11b. Collector lead terminals 1a and 1b are mounted to each composite and a printed board 14 with a wiring layer is arranged as supported with the terminals 1a and 1b. The electrodes of the composites the soldered to the wiring layer in a fixed arrangement. Then, an emitter electrode terminal 9b of the composite II is mounted at a fixed position of the printed board 14 while an electrode terminal (10b or the like) is mounted at the end thereof to be connected to the base and the emitter of each composite. Subsequently, a resin 16 is injected into a package 15 to make a module by hardening. This enables smaller module while facilitating the parallel connection of the module.</p>
申请公布号 JPS5715452(A) 申请公布日期 1982.01.26
申请号 JP19800090107 申请日期 1980.06.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAGI YOSHIO
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
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