| 摘要 |
PURPOSE:To improve the workability in the assembly process of hybrid ICs by facilitating optically sharp distinction by means of an assembly matching mark large in contrast with an insulating substrate for forming a thick film pattern. CONSTITUTION:Resistance elements 11 and conductive paths 12 are screen printed on a ceramic substrate 10 and active elements 13 are provided by chip application. Then, with a bonding by wires 14, a hybrid IC is created. For example, Ru2O3 powder paste is screen printed at a pattern space near the active elements 13 (or between external connected terminals 17) on the substrate 10 to form an assembly matching marks 15 and 16 with a sheet resistance of 1-10MOMEGA. The marks 15 and 16 provide an improved contrast with the substrate 10 because of better absorption of light as compared with the marking of the terminals 17 or the like thereby enabling the accurate and easy positioning at the chip application and the bonding. The use of a high resistance film eliminates troubeles in the function of any circuit configulation which may be contacted. |
