| 摘要 |
<p>PURPOSE:To reduce the size and cost of a semiconductor voltage regulator, for example, for a vehicle and to improve the reliability of the regulator by fixedly contain a power element chip and a thick substrate which loads controlling chip-shaped parts via a heat sink in a case and sealing it with resin. CONSTITUTION:A chip 10, e.g., a thyristor or the like is soldered to a heat sink 11, and is secured via solder material 12 to a case 1a. A transistor chip or the like is adhered and connected to a metallized layer in the vicinity of the power unit in the case 1a, and a ceramic substrate 13 in which parts 15, 16, e.g., capacitors or the like are mounted, is secured with an adhesive 14. Resin of, for example, polyurethane resin is injected in the case 1a in which the parts are contained to complete the regulator. Since the regulator can be reduced in size, in the cost of the parts and can also be facilitated in assembling in this manner, the cost can be reduced. Further, it can be strengthened against thermal and mechanical impacts by sealing it with soft resin, thereby improving the reliability.</p> |
