| 摘要 |
PURPOSE:To make it possible to perform each work during the recess of a table motion by placing the carrying in-and-out device, cleaning mechanism and grinding device of a wafer around the table which provides rotary indexing at every prescribed angle, in a rotary type grinding device using a semiconductor wafer, etc. CONSTITUTION:When an indexing table 3 is turned by 90 deg. at a time in the arrow direction, and stopped, two whetstones of a rough grinding whetstone 19a and a finish grinding whetstone 19b shift onto a wafer 10, allowing rough grinding and finish grinding to be performed. Then, an unloader mechanism 5b is turned by 90 deg. from a position shown in the drawing, and a finger 14 on the tip part of said unloader mechanism adsorbs the wafer 10 at a position D, and inserts it into an accommodating case 4b. The cleaning mechanism 7 cleans the wafer 10 while making a rod 24 stretch and having water injected from the tip part of the rod. The loading mechanism 5a takes out the wafer 10 from the accommodating case 4a and places said wafer 10 on a piston A. |
