| 摘要 |
PURPOSE:To increase the contacting area of an electronic part and to effectively weld it by forming many recesses at the position to be welded on the land of the printed circuit board of a semiconductor element and then welding it. CONSTITUTION:Many quadrangular pyramids are pressed to form recesses 3 on the position to be welded on the land of the printed circuit board of the back surface of a heat radiating fin 2 of a resin-molded power transistor. Since the welding position has many recesses in this manner, the contacting area with solder can be increased, can be effectively welded, and can increase the heat radiating effect. |
