| 摘要 |
PURPOSE:To reduce in size of a device by reducing number of fine adjustment parts so that a positioning mechanism becomes smaller and simpler, by separating a film guide, which is finely moved together with resin film for positioning with a semiconductor element, from a conveying-and-positioning devise as an independent unit. CONSTITUTION:A resin film 2 is rewound to a reel 33 from a reel 27 which is applied with reverse rotating force, and at the time of conveyance, rollers 29 and 31 are operated to give tension to the film between sprockets 28 and 32, feeding distances at entry side and exit side of a guide 30 are equalized, the guide 30 conveys to the set distaqnce at all times, and the joining position is roughly decided. At this time, width-wise direction of the film 2 is restricted by a guide 62 and vacuum- sucked 65, and it moves following movement of the guide 62. When a lever 68a of a manipulator is operated, the guide 62 moves by being contracted at a constant ratio through a member 66, so that an element 3 and the film 2 are positioned. And then, it is joined by a tool 73. It is possible, by employing this mechanism, to obtain a small and simple mounting device. |
