| 摘要 |
PURPOSE:To decrease mounting space by a method wherein the pellets of a semiconductor element are juxtaposed in the thickness direction at an elevated condition, and packaged integrally, and an external lead is drawn out from one package surface in the elevated direction. CONSTITUTION:Pellets 13 are bonded to the central concave section 12 of square ceramic bases 11, erected in the elevated direction, stacked in the thickness direction and unified. Inner leads 15 reaching the external leads 14 are metallized to the base 11, difference in stages is formed in the thickness direction and short circuits among the inner leads are prevented. The external leads 14 are all concentrated and arranged to one sides of the bases 11 and soldered to the inner leads 15, and the tips are drawn out in parallel in one direction. The assembled structures are stacked in the thickness direction and glued with glass 17 with the low melting point, and a ceramic cap 18 is bonded. According to this constitution, an occupying area in a plane can be decreased largely, and a mounting structure can be miniaturized. |
